CFD Simulation on IC Thermal Cooling through Water Involved TiO2, AlN and CuO Nanofluids
N. K. Kund

N. K. Kund, Department of Production Engineering, Veer Surendra Sai University of Technology, Burla (Sambalpur), Odisha, India.
Manuscript received on 02 July 2019 | Revised Manuscript received on 09 July 2019 | Manuscript published on 30 August 2019 | PP: 1976-1980 | Volume-8 Issue-10, August 2019 | Retrieval Number: J92880881019/2019©BEIESP | DOI: 10.35940/ijitee.J9288.0881019
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Abstract: In persevering courteousness, CFD codes got developed and run with water based TiO2 , AlN and CuO nanofluids to envision the thermal alarms of ICs. The convective governing equalities of mass, force and drive are computed for envisaging the thermal issues of ICs. The time pace selected throughout the intact computation is 0.0001 s. The soundings affect CFD forecasts of temperature curve, temperature arena plus fluid-solid boundary temperature of IC. Corresponding fluid-solid boundaries temperatures of IC are viewed as 351, 312 and 338 K for water based TiO2 , AlN and CuO nanofluids, respectively. The temperature of water-AlN nanofluid stands peak contiguous to the IC locality as it stands far less than the chancy temperature limit of 356 K. Further, the temperature of water-AlN nanofluid gently drops with improvement in aloofness from IC. Afterwards, this becomes surrounding temperature in the distant arena precinct. The analogous tinted temperature curve stands accessible. In addition, the congruent plot of temperature verses distance from IC stays publicized. The apprehension of CFD lenient stand adjacent to the facilities of expressions.
Keywords: ICFD Codes, Thermal Control, TiO2 , AlN and CuO Nanofluids.
Scope of the Article: Thermal Engineering