IC Fabrication Process Steps Analysis using Fuzzy DEMATEL Method
Velmathi Guruviah1, Felix Augustin2

1Velmathi Guruviah*, School of Electronics Engineering, Vellore Institute of Technology, Chennai, India.
2Felix Augustin, Division of Mathematics, School of Advanced Sciences, Vellore Institute of Technology, Chennai, India

Manuscript received on October 18, 2019. | Revised Manuscript received on 26 October, 2019. | Manuscript published on November 10, 2019. | PP: 1968-1973 | Volume-9 Issue-1, November 2019. | Retrieval Number: I7642078919/2019©BEIESP | DOI: 10.35940/ijitee.I7642.119119
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)

Abstract: Semiconductor industry and the process involved in fabrication play a major role in a modern technology whatever the field may be. In this paper, the study discusses about the complete process flow of the IC fabrication and the interdependence of each steps involved. Seven important process flow steps have been considered and explained throughout this study. In particular, the present work inspects comprehensively the correlation between each process steps by using fuzzy DEMATEL technique. The fabrication steps have been separated as cause and effect groups, for the readers to get a good understanding of a inter relationship between the seven process steps. The result has proved that the market requirement (C1), the complexity of the fabrication process (C3) and the streamline of supply chain and time to market (C7) fall under causal group and cost to customer , design , customization , testing yield , packaging fall under effect group. The research analysis by fuzzy DEMATEL method has been demonstrated as an efficient approach in the inter relationship studies.
Keywords: DEMATEL, IC fabrication, Yield, Process Steps
Scope of the Article: Fuzzy Logics