Development of Software for Measuring the Electrical Characteristics of the Information Storage Micromodule with Increased Radiation Resistance
R.S. Litvinenko1, V.M. Matveev2
1R.S. Litvinenko, Science Manufacturing Complex “Technological Centre”, Moscow, Zelenograd, Russia.
2V.M. Matveev, Science Manufacturing Complex “Technological Centre”, Moscow, Zelenograd, Russia.
Manuscript received on September 16, 2019. | Revised Manuscript received on 24 September, 2019. | Manuscript published on October 10, 2019. | PP: 52-55 | Volume-8 Issue-12, October 2019. | Retrieval Number: L24911081219/2019©BEIESP | DOI: 10.35940/ijitee.L2491.1081219
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: Development of software for automation of electrical characteristics measurement plays an important role, because this approach contributes to a significant time reduction. This article discusses the development and application of software for the study of electrical characteristics of miniature data storage modules developed by 3D integration technology for aerospace applications. In outer space there are a number of problems affecting the functioning of microelectronic equipment, in particular – heavy charged particles (HCP) that can lead to both single failures and latch-up effect, which is critical for memory chips. Therefore, there is a need to check the electrical parameters, such as the response time of protection against HCP. The software is developed in LabVIEW and can be used in manual and automatic modes, what allows to improve the efficiency of the testing process. The full range of measurements can be done by one operator in a short period of time.
Keywords: 3D Integration, Micromodule, latch-up Effect
Scope of the Article: Systems and Software Engineering