Experimental and Numerical Examinations of Temperature Distributions along SSF Pin Fins Cast through Semisolid Materials Processing
Pabak Mohapatra1, N. K. Kund2
1Pabak Mohapatra, Department of Production Engineering, Veer Surendra Sai University of Technology, Sambalpur, Odisha, India.
2N. K. Kund, VSS University of Technology, Burla, Odisha, India.
Manuscript received on September 16, 2019. | Revised Manuscript received on 24 September, 2019. | Manuscript published on October 10, 2019. | PP: 500-503 | Volume-8 Issue-12, October 2019. | Retrieval Number: L3389081219/2019©BEIESP | DOI: 10.35940/ijitee.L3389.1081219
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: Heat sinks or fins stand deployed for enhancing heat transfer. That’s why, planned experiments remain fortified for examining the impacts of SSF pin fin on thermal dispersal concerning constant thermal value 6 W/cm2 . For that five chromel-alumel thermocouples are preferred, above and beyond, SSF pin fins materials of stainless steel and aluminum. As anticipated, for both the stated SSF pin fins, temperature declines for increasing length scale. Besides, both results are comparable with each other. However, temperature distributions over SSF aluminum pin fin declines relatively at faster rate comparable to that over SSF stainless steel pin fin. Obviously, it may be owing to higher thermal conductivity of SSF aluminum pin fin. Therefore, it carries superior, pleasant and momentous thermal performances.
Keywords: Temperature Distribution, SSF Pin Fin, Stainless Steel, Aluminum, Thermal, Cooling Behavior.
Scope of the Article: Bio-Science and Bio-Technology