Application of a Double Layer Circular Microchannel Heat Sink in Electronic Industry
Sagar M. Narayanan1, Pradeep M. Kamath2
1Sagar M. Narayanan,Research Scholar, Department Of Mechanical Engineering, Government Engineering College, Thrissur, Kerala, India.
2Pradeep M. Kamath, Assistant Professor, Department Of Mechanical Engineering, Government Engineering College, Thrissur, Kerala, India. Email: email@example.com. | Revised Manuscript received on 24 September, 2019. | Manuscript published on October 10, 2019. | PP: 1153-1158 | Volume-8 Issue-12, October 2019. | Retrieval Number: L38901081219/2019©BEIESP | DOI: 10.35940/ijitee.L3890.1081219
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: The present paper is focused to evaluate the pressure drop and heat transfer performance of a double layer circular microchannel heat sink with numerically and experimentally. Numerical analysis is carried for various mass flow rates, with turbulent condition used in the ANSYS Fluent for two flow arrangements. The experiment is carried out by varying the mass flow rate ranges 3.32×10-4 kg/s to 27.72×10-4 kg/s with water as the cooling medium. The effect of a parallel flow and counter flow arrangements on heat transfer and flow parameters is studied for a constant heat input of 80W. The numerical result is nearly the same with the measured values. The pressure drop increases with the mass flow rate. The heat transfer enhancement is evaluated by the wall surface temperature and temperature uniformity. Even though parallel and counter flow arrangement has similar flow and thermal behavior, the latter has better temperature uniformity in the base of the heat sink for all pumping powers.
Keywords: Circular Micro Channel, Counter Flow, Double Layer, Experiment, Numerical, Parallel Flow.
Scope of the Article: Numerical Modelling of Structures