Design of Fins as Heat Sink for 80 watt Cob-Led Light
Muhammad Anas Rasool1, Ijaz Ahmad Chaudhry2, Muhammad Sohaib Hanif3, Muhammad Zeeshan Rafique4, Mansoor Ali Zaheer5, Atif Ilyas6
1Muhammad Anas Rasool, B.S degree in Mechanical Engineering from The University of Engineering and Technology, Lahore.
2Ijaz Ahmad Chaudhry, Dean School of Engineering, Chairperson Department of Industrial Engineering, UMT Lahore.
3Muhammad Sohaib Hanif, MSc Thermal Power Engineering, U.E.T Lahore.
4Muhammad Zeeshan Rafique, Assistant Professor in the Department of Mechanical Engineering, The University of Lahore.
5Mansoor Ali Zaheer, MSc Mechanical Design Engineering, U.E.T Lahore. BSc Mechanical Engineering, U.E.T Lahore.
6Atif Ilyas, Assistant Professor UOS, Sargodha. MSc Thermal Power Engineering, U.E.T Lahore. BSc Mechanical Engineering BZU, Multan.
Manuscript received on 02 June 2019 | Revised Manuscript received on 10 June 2019 | Manuscript published on 30 June 2019 | PP: 375-379 | Volume-8 Issue-8, June 2019 | Retrieval Number: H6359068819/19©BEIESP
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: LED lights have revolutionized the world by their performance. They consume less power as compared to previous lighting generations. However, large amount of power is dissipated in the form of heat. Therefore thermal management of LED is necessary to increase its life span and make it environmental friendly. For thermal management, aluminium heat sinks are widely used because aluminium profiles are easily manufactured and are good conductors of heat. In this article, we have intended to design the aluminium heat sink of eighty watt COB (Chip on Board) LED canopy light used in petrol pumps all around the world. We have designed the heat sink for 80W COB LEDs (40W each), and analysed the junction temperature through ANSYS fluent simulation. This design of heat sink and its fins are optimum and Thermal Interface Material is also used.
Keyword: COB, Fluent ANSYS, Heat sink, Junction Temperature, LED, Optimum Design, Thermal Analysis
Scope of the Article: Optimal Design of Structures